Inventor · disambiguated record
Hung-Yi Lin
Also filed as: LIN HUNG-YI
98 granted patents·85 pending applications·411 citations·filing 2000–2025
99Inventor score
Files withADVANCED SEMICONDUCTOR ENG44ASUSTEK COMP INC29LIN HUNG-YI28IND TECH RES INST12WALSIN LIHWA CORP11
Top patents by PatentIndex Score
183 records- 0195US11798890B2Assembly structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 24, 2023·2 cites·6 claims
- 0295US11342282B2Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·26 claims
- 0395US9997447B1Semiconductor devicesADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 12, 2018·14 cites·17 claims
- 0494US11063013B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 13, 2021·10 cites·18 claims
- 0592US11824029B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 21, 2023·2 cites·12 claims
- 0692US11410594B1Dynamic bias control of source driver based on data swing level for power savingNOVATEK MICROELECTRONICS CORP·Filed 2021·Granted Aug 9, 2022·4 cites·4 claims
- 0791USD703680SFlash drivePOWER QUOTIENT INT CO LTD·Filed 2013·Granted Apr 29, 2014·45 cites·1 claims
- 0889US8698792B2Low-power display control method and associated display controllerCHANG JEN-TANG·Filed 2010·Granted Apr 15, 2014·29 cites·18 claims
- 0988US12374631B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 29, 2025·1 cites·14 claims
- 1088US8456724B2Biaxial scanning mirror for image forming apparatusLIN HUNG-YI·Filed 2010·Granted Jun 4, 2013·11 cites·13 claims
- 1186US8405678B2Display controller for displaying multiple windows and method for the sameCHENG KUN-NAN·Filed 2008·Granted Mar 26, 2013·10 cites·21 claims
- 1286US7514287B2Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS deviceTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Apr 7, 2009·17 cites·14 claims
- 1386US6359718B1Actuating mechanism for rotating micro-mirrorWALSIN LIHWA CORP·Filed 2001·Granted Mar 19, 2002·37 cites·15 claims
- 1483USD945517SCamera holderWU MENG TSUNG·Filed 2020·Granted Mar 8, 2022·10 cites·1 claims
- 1583US10475718B2Semiconductor device package comprising a dielectric layer with built-in inductorADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·5 cites·18 claims
- 1682US11508668B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·1 cites·11 claims
- 1780US11348885B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 31, 2022·2 cites·18 claims
- 1880US10088943B2Touch control device and operating method thereofASUSTEK COMP INC·Filed 2016·Granted Oct 2, 2018·3 cites·20 claims
- 1980US7741772B2White LED package structure having a silicon substrate and method of making the sameTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Jun 22, 2010·8 cites·7 claims
- 2080USD580929SHandheld electronic deviceKINPO ELECT INC·Filed 2006·Granted Nov 18, 2008·30 cites·1 claims
- 2180US7392687B2Method of calibrating zero offset of a pressure sensorTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Jul 1, 2008·13 cites·10 claims
- 2278US11769712B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 26, 2023·1 cites·11 claims
- 2378US8378717B1High-speed BiCMOS double sampling track-and-hold amplifier circuitUNIV NAT TAIPEI TECHNOLOGY·Filed 2011·Granted Feb 19, 2013·9 cites·9 claims
- 2478US7732233B2Method for making light emitting diode chip packageTOUCH MICRO SYSTEM TECH·Filed 2009·Granted Jun 8, 2010·12 cites·13 claims
- 2578US2025349725A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2677US11296043B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·2 cites·19 claims
- 2777US6372610B1Method for die separation of a wafer by ion implantationIND TECH RES INST·Filed 2000·Granted Apr 16, 2002·27 cites·7 claims
- 2876US7492370B2Management method and display method of on-screen display thereof and related display controlling deviceMSTAR SEMICONDUCTOR INC·Filed 2005·Granted Feb 17, 2009·3 cites·16 claims
- 2975US10490341B2Electrical deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 26, 2019·2 cites·22 claims
- 3074US10474354B2Writing gesture notification method and electronic system using the sameASUSTEK COMP INC·Filed 2017·Granted Nov 12, 2019·2 cites·10 claims
- 3174US8217329B2Microminiaturized projection module having an image processing unit for transforming each of image signals into a modulating signal and a direction signal for projecting image onto objectCHIANG CHUNG-I·Filed 2010·Granted Jul 10, 2012·3 cites·21 claims
- 3274US2023403078A1System comprising packaged optical devicesADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3373US11935841B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Mar 19, 2024·0 cites·15 claims
- 3473US8455910B2Method of manufacturing light emitting diode packaging lens and light emitting diode packageCHIANG CHUNG-I·Filed 2009·Granted Jun 4, 2013·6 cites·7 claims
- 3571US12368104B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 22, 2025·0 cites·16 claims
- 3671US12051658B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 30, 2024·0 cites·14 claims
- 3770US11722220B2System comprising packaged optical devicesADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·10 claims
- 3870US8453318B2Method for making a planar coilTOUCH MICRO SYSTEM TECH·Filed 2012·Granted Jun 4, 2013·2 cites·13 claims
- 3970US8114699B2Integration manufacturing process for MEMS deviceWU MIGCHING·Filed 2011·Granted Feb 14, 2012·2 cites·5 claims
- 4070US7062345B2Wafer lot identity management system and method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 13, 2006·4 cites·28 claims
- 4170US2025133322A1Wearable component, ear tip, and method of manufacturing a wearable componentADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 4269US12463157B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 4, 2025·0 cites·20 claims
- 4369USD712414SFlash drivePOWER QUOTIENT INT CO LTD·Filed 2013·Granted Sep 2, 2014·16 cites·1 claims
- 4468US12218075B2Package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 4, 2025·0 cites·18 claims
- 4565US8803899B2Image processing system and image processing methodCHEN JIUNN-KUANG·Filed 2010·Granted Aug 12, 2014·1 cites·20 claims
- 4665US2025183197A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 4764US7934314B2Conductive film structure, fabrication method thereof, and conductive film type probe device for ICIND TECH RES INST·Filed 2008·Granted May 3, 2011·2 cites·19 claims
- 4864US7510892B2Light emitting diode structure and manufacturing method thereofTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Mar 31, 2009·2 cites·12 claims
- 4964US2025228994A1Fragrance lanyardADAM ELEMENTS INT CO LTD·Filed 2024·Application pending·0 cites
- 5064US2025226137A1Magnetic positioning structure for expanded deviceADAM ELEMENTS INT CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 183 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →