Inventor · disambiguated record
Hui Kin Lit
Also filed as: LIT HUI KIN
3 granted patents·1 pending application·0 citations·filing 2020–2025
44Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0167US12080625B2Semiconductor package with releasable isolation layer protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Sep 3, 2024·0 cites·11 claims
- 0257US11791238B2Semiconductor package with releasable isolation layer protectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Oct 17, 2023·0 cites·9 claims
- 0349US11804424B2Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 0448US2025308942A1Method of forming a die package and die packageINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →