Inventor · disambiguated record
Huihong Liu
Also filed as: LIU HUIHONG
2 granted patents·1 pending application·2 citations·filing 2019–2022
35Inventor score
Technology areasB23K
Files withUNIV OSAKA3
Top patents by PatentIndex Score
3 records- 0183US11745287B2Metal material solid-phase bonding method and solid-phase bonding deviceUNIV OSAKA·Filed 2019·Granted Sep 5, 2023·2 cites·10 claims
- 0266US12240052B2Friction pressure welding methodUNIV OSAKA·Filed 2021·Granted Mar 4, 2025·0 cites·11 claims
- 0360US2024316689A1Solid-state joining method, solid-state joined joint, solid-state joined structure, and solid-state joining deviceUNIV OSAKA·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →