Inventor · disambiguated record
Hung-Wen Liu
Also filed as: LIU HUNG-WEN
15 granted patents·7 pending applications·54 citations·filing 2002–2024
90Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD9BENQ CORP5MICRON TECHNOLOGY INC3QISDA CORP2CHANG CHIANG-CHENG1
Top patents by PatentIndex Score
22 records- 0185US11710702B2Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 25, 2023·2 cites·18 claims
- 0283US6796538B2Adjusting deviceBENQ CORP·Filed 2002·Granted Sep 28, 2004·26 cites·11 claims
- 0375US8828796B1Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 0471US12211798B1Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·18 claims
- 0571US7275834B2Air guide plate and lamp assembly utilizing the sameBENQ CORP·Filed 2005·Granted Oct 2, 2007·4 cites·10 claims
- 0667US9666536B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 30, 2017·1 cites·12 claims
- 0765US8766456B2Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jul 1, 2014·2 cites·20 claims
- 0865US7409271B2Electronic device with height adjusting mechanismQISDA CORP·Filed 2005·Granted Aug 5, 2008·7 cites·13 claims
- 0963US7253967B2Optical assembly with a lens magnification-adjusting functionBENQ CORP·Filed 2006·Granted Aug 7, 2007·4 cites·9 claims
- 1062US9397081B2Fabrication method of semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 19, 2016·1 cites·12 claims
- 1161US2025191993A1Semiconductor device assembly with thermally-conductive filler in an inter-die gapMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1260US9177859B2Semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 3, 2015·1 cites·10 claims
- 1357US7459770B2Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Dec 2, 2008·2 cites·8 claims
- 1453US10966797B2Imaging systemQISDA CORP·Filed 2020·Granted Apr 6, 2021·0 cites·7 claims
- 1548US2017236783A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1645US9224646B2Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 29, 2015·0 cites·8 claims
- 1743US2006164608A1Projection optical systemBENQ CORP·Filed 2006·Application pending·0 cites
- 1839US2006164609A1Projector having light-shielding module and image processing method thereofBENQ CORP·Filed 2006·Application pending·0 cites
- 1938US9607974B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 2037US2007085974A1Projector capable of illuminating a connection interface thereof and method thereofYU SHIH-HUNG·Filed 2006·Application pending·0 cites
- 2137US2012313243A1Chip-scale packageCHANG CHIANG-CHENG·Filed 2011·Application pending·0 cites
- 2236US2014042638A1Semiconductor package and method of fabricating the sameSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →