Inventor · disambiguated record
Hubert Vander Plas
Also filed as: PLAS HUBERT VANDER
3 granted patents·148 citations·filing 2002–2004
73Inventor score
Technology areasH10W
Files withHEWLETT PACKARD DEVELOPMENT CO3
Top patents by PatentIndex Score
3 records- 0193US6716737B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 6, 2004·133 cites·32 claims
- 0262US6902872B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jun 7, 2005·11 cites·38 claims
- 0349US7432582B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 7, 2008·4 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →