Inventor · disambiguated record
Huilin Ren
Also filed as: REN HUILIN
14 granted patents·2 pending applications·923 citations·filing 2003–2025
94Inventor score
Top patents by PatentIndex Score
16 records- 0198US8814595B2High speed, high density electrical connectorCOHEN THOMAS S·Filed 2012·Granted Aug 26, 2014·106 cites·39 claims
- 0298US8272877B2High density electrical connector and PCB footprintSTOKOE PHILIP T·Filed 2011·Granted Sep 25, 2012·126 cites·31 claims
- 0398US8182289B2High density electrical connector with variable insertion and retention forceSTOKOE PHILIP T·Filed 2011·Granted May 22, 2012·149 cites·25 claims
- 0498US6776659B1High speed, high density electrical connectorTERADYNE INC·Filed 2003·Granted Aug 17, 2004·264 cites·16 claims
- 0597US11758656B2Backplane footprint for high speed, high density electrical connectorsAMPHENOL CORP·Filed 2021·Granted Sep 12, 2023·4 cites·6 claims
- 0697US11057995B2Backplane footprint for high speed, high density electrical connectorsAMPHENOL CORP·Filed 2019·Granted Jul 6, 2021·14 cites·14 claims
- 0797US6814619B1High speed, high density electrical connector and connector assemblyTERADYNE INC·Filed 2003·Granted Nov 9, 2004·177 cites·24 claims
- 0891US6780059B1High speed, high density electrical connectorTERADYNE INC·Filed 2003·Granted Aug 24, 2004·53 cites·22 claims
- 0987US2025063662A1Backplane footprint for high speed, high density electrical connectorsAMPHENOL CORP·Filed 2024·Application pending·0 cites
- 1082US12171063B2Backplane footprint for high speed, high density electrical connectorsAMPHENOL CORP·Filed 2023·Granted Dec 17, 2024·0 cites·7 claims
- 1179US7508681B2Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristicsAMPHENOL CORP·Filed 2007·Granted Mar 24, 2009·7 cites·19 claims
- 1275US7242592B2Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristicsAMPHENOL CORP·Filed 2003·Granted Jul 10, 2007·20 cites·20 claims
- 1372US11901660B2High speed, high density electrical connectorAMPHENOL CORP·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1471US2025260200A1High speed and high density near chip connectorFCI USA LLC·Filed 2025·Application pending·0 cites
- 1567US9825391B2Method of forming an electrical connectorAMPHENOL CORP·Filed 2014·Granted Nov 21, 2017·3 cites·10 claims
- 1651US10958007B2High speed, high density electrical connectorAMPHENOL CORP·Filed 2017·Granted Mar 23, 2021·0 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →