Inventor · disambiguated record
Hussain Shaukatullah
Also filed as: SHAUKATULLAH HUSSAIN
8 granted patents·2 pending applications·1,069 citations·filing 1989–2006
92Inventor score
Top patents by PatentIndex Score
10 records- 0196US5744863AChip carrier modules with heat sinks attached by flexible-epoxyIBM·Filed 1995·Granted Apr 28, 1998·243 cites·34 claims
- 0295US5814877ASingle layer leadframe design with groundplane capabilityIBM·Filed 1996·Granted Sep 29, 1998·212 cites·20 claims
- 0395US5672548AMethod for attaching heat sinks directly to chip carrier modules using flexible-epoxyIBM·Filed 1996·Granted Sep 30, 1997·191 cites·36 claims
- 0495US5543657ASingle layer leadframe design with groundplane capabilityIBM·Filed 1994·Granted Aug 6, 1996·243 cites·11 claims
- 0586US6219238B1Structure for removably attaching a heat sink to surface mount packagesIBM·Filed 1999·Granted Apr 17, 2001·61 cites·15 claims
- 0685US5785799AApparatus for attaching heat sinks directly to chip carrier modules using flexible epoxyIBM·Filed 1997·Granted Jul 28, 1998·65 cites·4 claims
- 0775US5639694AMethod for making single layer leadframe having groundplane capabilityIBM·Filed 1995·Granted Jun 17, 1997·41 cites·19 claims
- 0847US4964737ARemovable thermocouple template for monitoring temperature of multichip modulesIBM·Filed 1989·Granted Oct 23, 1990·13 cites·21 claims
- 0940US2006182952A1Encapsulated thermally conductive electrically insulating assembly and method to prepare sameJUSTO ROGER J·Filed 2006·Application pending·0 cites
- 1035US2003128519A1Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using sameIBM·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hussain Shaukatullah files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →