Inventor · disambiguated record
Hugh E. Stroupe
Also filed as: HUDSON GUY F · STROUPE HUGH · STROUPE HUGH E
34 granted patents·1,947 citations·filing 1992–2007
98Inventor score
Files withMICRON TECHNOLOGY INC34
Top patents by PatentIndex Score
34 records- 0199US6410459B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 25, 2002·539 cites·16 claims
- 0298US5533924APolishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafersMICRON TECHNOLOGY INC·Filed 1994·Granted Jul 9, 1996·198 cites·23 claims
- 0397US5792709AHigh-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 11, 1998·185 cites·12 claims
- 0497US5232875AMethod and apparatus for improving planarity of chemical-mechanical planarization operationsMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 3, 1993·397 cites·25 claims
- 0596US5664988AProcess of polishing a semiconductor wafer having an orientation edge discontinuity shapeMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 9, 1997·140 cites·14 claims
- 0695US6103636AMethod and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 15, 2000·122 cites·64 claims
- 0793US6653722B2Method for applying uniform pressurized film across waferMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 25, 2003·60 cites·38 claims
- 0888US6329301B1Method and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 11, 2001·25 cites·64 claims
- 0988US5807767ATechnique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 15, 1998·53 cites·19 claims
- 1087US6472725B1Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·25 cites·10 claims
- 1179US6610610B2Methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·13 cites·64 claims
- 1278US6069028ATechnique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 1998·Granted May 30, 2000·28 cites·21 claims
- 1376US6506679B2Deadhesion method and mechanism for wafer processingMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·14 cites·183 claims
- 1476US6309913B1Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 30, 2001·12 cites·21 claims
- 1575US7449368B2Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 11, 2008·3 cites·13 claims
- 1674US6555897B2Assembly for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·10 cites·14 claims
- 1774US5945729ATechnique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 31, 1999·24 cites·41 claims
- 1872US6530113B2Apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 11, 2003·8 cites·31 claims
- 1972US6518172B1Method for applying uniform pressurized film across waferMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 11, 2003·12 cites·68 claims
- 2069US6828227B2Method for applying uniform pressurized film across waferMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 7, 2004·9 cites·68 claims
- 2166US7135763B2Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 14, 2006·6 cites·14 claims
- 2266US6316363B1Deadhesion method and mechanism for wafer processingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·23 cites·183 claims
- 2358US8053371B2Apparatus and methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 8, 2011·0 cites·18 claims
- 2458US7244681B2Methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 17, 2007·3 cites·19 claims
- 2558US6889698B2Apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2003·Granted May 10, 2005·3 cites·17 claims
- 2658US6307254B1Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 23, 2001·11 cites·17 claims
- 2757US6429146B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·3 cites·2 claims
- 2856US6882032B2Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 19, 2005·3 cites·13 claims
- 2953US7307353B2Technique for attaching die to leadsMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 11, 2007·2 cites·29 claims
- 3053US6380086B1High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 30, 2002·14 cites·11 claims
- 3152US6693034B2Deadhesion method and mechanism for wafer processingMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·2 cites·183 claims
- 3243US6624089B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 23, 2003·0 cites·13 claims
- 3342US6656402B2Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 2, 2003·0 cites·16 claims
- 3442US6645345B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 11, 2003·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →