Inventor · disambiguated record
Hung-Ming Su
Also filed as: SU HUNG-MING
2 granted patents·0 citations·filing 2020–2020
23Inventor score
Technology areasH10P
Files withWINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
2 records- 0146US11367718B1Layout for measuring overlapping stateWINBOND ELECTRONICS CORP·Filed 2020·Granted Jun 21, 2022·0 cites·14 claims
- 0245US11688651B2Semiconductor structure, manufacturing method thereof and method for detecting short thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Jun 27, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →