Inventor · disambiguated record
Hung-Wen Su
Also filed as: SU HUNG-WEN
95 granted patents·25 pending applications·702 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD84TAIWAN SEMICONDUCTOR MFG25SU HUNG-WEN3CHEN CHIEN-AN1LEE HSIEN MING1
Top patents by PatentIndex Score
120 records- 0198US11682624B2Method of forming an interconnect structure having an air gap and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·4 cites·20 claims
- 0298US9520362B2Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 13, 2016·38 cites·20 claims
- 0397US11374127B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·4 cites·20 claims
- 0497US8736056B2Device for reducing contact resistance of a metalLEE YA-LIEN·Filed 2012·Granted May 27, 2014·399 cites·15 claims
- 0596US11380542B2Selective capping processes and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·20 claims
- 0696US9269612B2Mechanisms of forming damascene interconnect structuresCHEN CHIEN-AN·Filed 2012·Granted Feb 23, 2016·32 cites·20 claims
- 0794US11676898B2Diffusion barrier for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·4 cites·16 claims
- 0894US10770288B2Selective capping processes and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·9 cites·20 claims
- 0994US10312098B2Method of forming an interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·6 cites·20 claims
- 1093US9496169B2Method of forming an interconnect structure having an air gap and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 15, 2016·6 cites·20 claims
- 1193US9343294B2Interconnect structure having air gap and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·13 cites·20 claims
- 1292US11742290B2Interconnect structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·20 claims
- 1391US8962473B2Method of forming hybrid diffusion barrier layer and semiconductor device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 24, 2015·10 cites·19 claims
- 1491US7538434B2Copper interconnection with conductive polymer layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 26, 2009·24 cites·23 claims
- 1591US7312531B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 25, 2007·22 cites·32 claims
- 1691US2025070027A1Method of forming an interconnect structure having an air gap and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1790US11535950B2Electro-plating and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 27, 2022·1 cites·20 claims
- 1890US10727350B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·4 cites·20 claims
- 1990US9518334B2Electro-plating and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 13, 2016·3 cites·19 claims
- 2089US9754882B2Interconnect structure having air gap and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 2188US11552018B2Chemical direct pattern plating methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·20 claims
- 2288US10790142B2Selective capping processes and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·4 cites·20 claims
- 2388US10199500B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·20 claims
- 2487US2024395939A1Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2586US12159838B2Method of forming an interconnect structure having an air gap and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 2685US12469745B2Conductive structures with bottom-less barriers and linersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 2785US10163644B2Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·4 cites·20 claims
- 2885US9917058B2Method of forming an interconnect structure having an air gap and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·2 cites·20 claims
- 2983US12166128B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3083US10522399B2Physical vapor deposition process for semiconductor interconnection structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·20 claims
- 3183US9029260B2Gap filling method for dual damascene processLIN CHUN CHIEH·Filed 2011·Granted May 12, 2015·6 cites·20 claims
- 3282US11908697B2Interconnect structure having a carbon-containing barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 3382US10867800B2Method of forming an interconnect structure having a carbon-containing barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·1 cites·20 claims
- 3480US12237261B2Semiconductor device having a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 3580US11018055B2Physical vapor deposition process for semiconductor interconnection structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·2 cites·20 claims
- 3679US11777035B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 3778US12315809B2Via for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 3878US12165975B2Method of forming interconnect structure having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3978US11830742B2Selective capping processes and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 4078US10438846B2Physical vapor deposition process for semiconductor interconnection structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 8, 2019·2 cites·20 claims
- 4178US7803896B2Polyimide-titania hybrid materials, their preparation, and film prepared from the materialsUNIV NAT TAIWAN·Filed 2007·Granted Sep 28, 2010·3 cites·13 claims
- 4277US11996361B2Method of making a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 4377US9887073B2Physical vapor deposition system and physical vapor depositing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 6, 2018·2 cites·20 claims
- 4477US2025364324A1Conductive structures with bottom-less barriers and linersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4577US2025279364A1Via for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4677US2025183161A1Method of making semiconductor device having a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4777US2024413087A1Interconnect Structure and Method of Forming ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4876US11851749B2Semiconductor device, method and machine of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4976US11527411B2Interconnect structure having a carbon-containing barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 5076US8975187B2Stress-controlled formation of tin hard maskTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
Showing the top 50 of 120 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hung-Wen Su files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →