Inventor · disambiguated record
Hua-Hsin Su
Also filed as: SU HUA-HSIN
6 granted patents·9 pending applications·16 citations·filing 2005–2022
73Inventor score
Top patents by PatentIndex Score
15 records- 0187US9400359B1Optical transmitter package structureLUXNET CORP·Filed 2015·Granted Jul 26, 2016·10 cites·14 claims
- 0280US12007612B2Silicon photonics optical transceiver deviceWAVESPLITTER TECH INC·Filed 2022·Granted Jun 11, 2024·2 cites·5 claims
- 0376US9854674B1Flexible printed circuit and printed circuit board soldered structureLUXNET CORP·Filed 2017·Granted Dec 26, 2017·4 cites·12 claims
- 0446US10656355B2Heat dissipation structure of horizontal optical-communication sub-assemblyLUXNET CORP·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 0542US9991674B2Optical transmitter with a heat dissipation structureLUXNET CORP·Filed 2016·Granted Jun 5, 2018·0 cites·19 claims
- 0640US2008042157A1Surface mount light emitting diode packageFORMOSA EPITAXY INC·Filed 2006·Application pending·0 cites
- 0739US2015253520A1Transmitting device package structureLUXNET CORP·Filed 2014·Application pending·0 cites
- 0839US2007243645A1High-Power LED Chip Packaging Structure And Fabrication Method ThereofLIN CHENG·Filed 2007·Application pending·0 cites
- 0936US2007126020A1High-power LED chip packaging structure and fabrication method thereofLIN CHENG·Filed 2005·Application pending·0 cites
- 1035US9847307B1Two-end driving, high-frequency sub-substrate structure and high-frequency transmission structure including the sameLUXNET CORP·Filed 2017·Granted Dec 19, 2017·0 cites·20 claims
- 1135US2018188457A1Optical communication module configured for enhancing optical coupling efficiencyLUXNET CORP·Filed 2017·Application pending·0 cites
- 1232US2018188458A1Optical communication module configured for enhancing optical coupling efficiencyLUXNET CORP·Filed 2017·Application pending·0 cites
- 1331US2018190520A1Composite heat-dissipating substrateLUXNET CORP·Filed 2017·Application pending·0 cites
- 1431US2018248336A1Assembly of semiconductor and highly thermally conductive heat-dissipating substratesLUXNET CORP·Filed 2018·Application pending·0 cites
- 1530US2018191131A1Heat-dissipating semiconductor assemblyLUXNET CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →