Inventor · disambiguated record
Hung Chun Tsai
Also filed as: TSAI HUNG-CHUN
13 granted patents·4 pending applications·66 citations·filing 1997–2015
89Inventor score
Top patents by PatentIndex Score
17 records- 0192US8053356B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·9 cites·19 claims
- 0285US7655556B2Interconnect structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 2, 2010·6 cites·10 claims
- 0385US7115974B2Silicon oxycarbide and silicon carbonitride based materials for MOS devicesTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2004·Granted Oct 3, 2006·34 cites·19 claims
- 0482US8143162B2Interconnect structure having a silicide/germanide cap layerYU CHEN-HUA·Filed 2009·Granted Mar 27, 2012·9 cites·20 claims
- 0575US7834458B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 16, 2010·2 cites·17 claims
- 0662US8999842B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 7, 2015·0 cites·20 claims
- 0760US9219036B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Dec 22, 2015·0 cites·20 claims
- 0858US8785324B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·0 cites·17 claims
- 0956US8330275B2Interconnect structure for semiconductor devicesCHANG HUI-LIN·Filed 2011·Granted Dec 11, 2012·0 cites·19 claims
- 1049US2011315215A1Color building-integrated photovoltaic (bipv) moduleCHEN LIANG-JYI·Filed 2011·Application pending·0 cites
- 1149US2011315216A1Color building-integrated photovoltaic (bipv) moduleCHEN LIANG-JYI·Filed 2011·Application pending·0 cites
- 1246US7629273B2Method for modulating stresses of a contact etch stop layerTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 8, 2009·0 cites·9 claims
- 1344US8101437B2Method of forming three-terminal solar cell arrayTSAI HUNG-CHUN·Filed 2010·Granted Jan 24, 2012·0 cites·10 claims
- 1443US7256124B2Method of fabricating semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 14, 2007·0 cites·12 claims
- 1542US2011308569A1Multi-terminal solar panelTSAI HUNG-CHUN·Filed 2011·Application pending·0 cites
- 1641US2011155230A1Multi-bandgap solar cell and method producing the sameDU PONT APOLLO LTD·Filed 2010·Application pending·0 cites
- 1731US6159387AManufacturing process and structure of ink jet printheadMICROJET TECHNOLOGY CO INC·Filed 1997·Granted Dec 12, 2000·6 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →