Inventor · disambiguated record
Hung-Wei Tsai
Also filed as: TSAI HUNG-WEI
5 granted patents·4 pending applications·25 citations·filing 2013–2025
72Inventor score
Top patents by PatentIndex Score
9 records- 0196US10157888B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 0281US2025266356A1Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0379US12315806B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 0472US10867919B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
- 0569US11670593B2Package-on-package (POP) electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 0660US2025285999A1Interposer module including equipotential pad, package structure including the interposer module and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0755US2024312940A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0847US9023663B2Method for preparing nano-sheet array structure of group V-VI semiconductorNAT UNIV TSING HUA·Filed 2014·Granted May 5, 2015·0 cites·10 claims
- 0943US2014204175A1Image conversion method and module for naked-eye 3d displayUNIV NAT CHENG KUNG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →