Inventor · disambiguated record
Hua-Wei Tseng
Also filed as: TSENG HUA-WEI
20 granted patents·19 pending applications·78 citations·filing 2014–2025
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
39 records- 0197US9793246B1Pop devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·30 cites·20 claims
- 0296US12062602B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·3 cites·20 claims
- 0396US10879224B2Package structure, die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·15 cites·20 claims
- 0495US11587900B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·20 claims
- 0592US12159853B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·1 cites·20 claims
- 0689US11075150B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·4 cites·18 claims
- 0788US9406629B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·8 cites·12 claims
- 0887US12431417B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0987US2025323133A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1085US10290610B2PoP device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 1181US10541226B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 21, 2020·3 cites·19 claims
- 1280US12211782B2Semiconductor package dielectric susbtrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1380US11088094B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1480US2025125249A1Semiconductor package dielectric susbtrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1579US2025054894A1Package structure including ipd and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1678US11984410B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 1777US10276542B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·3 cites·20 claims
- 1877US2025357217A1Edge profile control of integrated circuit chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1976US10037973B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·2 cites·20 claims
- 2074US2025329685A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2174US2025329623A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2272US11961796B2Semiconductor package dielectric substrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2372US11682637B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 2470US2025167161A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2570US2025140667A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2659US2025253222A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2757US2024128211A1Semiconductor die package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2857US2025125223A1Passivation structure and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2956US2025149524A1Package structure including a redistribution layer (rdl) structure with a recessed portion and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3056US2024429142A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3155US2019371718A1Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
- 3254US10950575B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·20 claims
- 3354US2025062202A1Package structure, semiconductor die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3454US2024030168A1Wafer-on-wafer packaging with continuous seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3554US2024178086A1Package, package structure and method of manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3654US2024055311A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3753US2016064340A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Application pending·0 cites
- 3840US11201142B2Semiconductor package, package on package structure and method of froming package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 14, 2021·0 cites·9 claims
- 3940US10756037B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →