Inventor · disambiguated record
Hubert A. Vander Plas
Also filed as: VANDER PLAS HUBERT A · VANDER PLAS HUBERT ALLEN
9 granted patents·1 pending application·527 citations·filing 1994–2009
90Inventor score
Top patents by PatentIndex Score
10 records- 0197US5539153AMethod of bumping substrates by contained paste depositionHEWLETT PACKARD CO·Filed 1994·Granted Jul 23, 1996·187 cites·29 claims
- 0296US5672542AMethod of making solder balls by contained paste depositionHEWLETT PACKARD CO·Filed 1996·Granted Sep 30, 1997·125 cites·13 claims
- 0395US5880017AMethod of bumping substrates by contained paste depositionHEWLETT PACKARD CO·Filed 1997·Granted Mar 9, 1999·117 cites·18 claims
- 0489US5586715AMethod of making solder balls by contained paste depositionHEWLETT PACKARD CO·Filed 1996·Granted Dec 24, 1996·59 cites·9 claims
- 0575US6085968ASolder retention ring for improved solder bump formationHEWLETT PACKARD CO·Filed 1999·Granted Jul 11, 2000·36 cites·5 claims
- 0662US2012014820A1Repairing defects in a piezoelectric memberMARDILOVICH PETER·Filed 2009·Application pending·0 cites
- 0743US7777403B2Photonic-crystal filament and methodsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 17, 2010·0 cites·33 claims
- 0843US6764937B1Solder on a sloped surfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 20, 2004·2 cites·26 claims
- 0941US6979906B2Solder on a sloped surfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Dec 27, 2005·1 cites·14 claims
- 1028US6659592B2Multiple redundant through hole electrical interconnects and method for forming the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Dec 9, 2003·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →