Inventor · disambiguated record
Huang-Wen Wang
Also filed as: WANG HUANG-WEN
2 granted patents·0 citations·filing 2017–2021
22Inventor score
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2 records- 0134US10374129B2Compound semiconductors having an improved high temperature resistant backside metallizationWIN SEMICONDUCTORS CORP·Filed 2017·Granted Aug 6, 2019·0 cites·15 claims
- 0231US11768793B2Plug-in mobile peripheral component interconnect express module connectorDUN PU ELECTRONICS CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →