Inventor · disambiguated record
Hujiao Wang
Also filed as: WANG HUJIAO
2 granted patents·2 citations·filing 2013–2018
38Inventor score
Top patents by PatentIndex Score
2 records- 0157US10581183B2High speed board to board connection deviceMOLEX LLC·Filed 2018·Granted Mar 3, 2020·1 cites·25 claims
- 0255US9431317B2Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit packageCISCO TECH INC·Filed 2013·Granted Aug 30, 2016·1 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →