Inventor · disambiguated record
Hui Teng Wang
Also filed as: WANG HUI · WANG HUI TENG
7 granted patents·1 pending application·36 citations·filing 2003–2019
80Inventor score
Files withINFINEON TECHNOLOGIES AG3FREESCALE SEMICONDUCTOR INC1NEMTSEV GENNADIY1SEMICONDUCTOR COMPONENTS IND1TONG CHONG YEE1
Top patents by PatentIndex Score
8 records- 0183US9190351B2Semiconductor device with webbing between leadsFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Nov 17, 2015·6 cites·18 claims
- 0273US6897561B2Semiconductor power device having a diamond shaped metal interconnect schemeSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted May 24, 2005·24 cites·20 claims
- 0371US9111772B1Electronic array and chip packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 18, 2015·3 cites·25 claims
- 0454US8207037B2Method for manufacturing a semiconductor component that includes a field plateWANG HUI·Filed 2007·Granted Jun 26, 2012·1 cites·20 claims
- 0552US10861828B2Molded semiconductor package having a package-in-package structure and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 8, 2020·0 cites·18 claims
- 0652US8916958B2Semiconductor package with multiple chips and substrate in metal capTONG CHONG YEE·Filed 2009·Granted Dec 23, 2014·2 cites·15 claims
- 0747US10418343B2Package-in-package structure for semiconductor devices and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 17, 2019·0 cites·12 claims
- 0838US2009108343A1Semiconductor component and method of manufactureNEMTSEV GENNADIY·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →