Inventor · disambiguated record
Hung-Jen Wang
Also filed as: WANG HUNG J · WANG HUNG-JEN
6 granted patents·12 pending applications·29 citations·filing 2005–2024
77Inventor score
Files withTAIWAN SOLUTIONS SYSTEMS CORP4HANNSTAR DISPLAY CORP3LIN CHI CHIH2WINTEK CORP2CHEN YAN-JOU1
Top patents by PatentIndex Score
18 records- 0189US8072411B2Gate line driving circuit of LCD panelCHEN YAN-JOU·Filed 2009·Granted Dec 6, 2011·15 cites·7 claims
- 0278US7957110B2Display apparatus current discharging methodHANNSTAR DISPLAY CORP·Filed 2007·Granted Jun 7, 2011·5 cites·26 claims
- 0370US12494081B1Acoustic sensors with refractive microlensQUALCOMM INC·Filed 2024·Granted Dec 9, 2025·0 cites·17 claims
- 0470US8872747B2LCD panel with structure of Cs-on-gate type storage capacitor connecting with thin film transistorWINTEK CORP·Filed 2013·Granted Oct 28, 2014·1 cites·13 claims
- 0568US8013434B2Thin double-sided package substrate and manufacture method thereofLIGHT OCEAN TECHNOLOGY CORP·Filed 2008·Granted Sep 6, 2011·8 cites·10 claims
- 0650US2009154628A1Scan signal generating circuit and scan signal generating method thereofHANNSTAR DISPLAY CORP·Filed 2008·Application pending·0 cites
- 0749US2010238100A1LCD PanelWINTEK CORP·Filed 2010·Application pending·0 cites
- 0845US2009109362A1Display deviceHANNSTAR DISPLAY CORP·Filed 2008·Application pending·0 cites
- 0940US8629947B2Liquid crystal panelCHEN YU-TING·Filed 2009·Granted Jan 14, 2014·0 cites·7 claims
- 1038US2008135939A1Fabrication method of semiconductor package and structure thereofLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 1137US2008182360A1Fabrication method of semiconductor packageLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 1237US2014029078A1Devices and methods for protecting electromechanical device arraysFENNELL LEONARD EUGENE·Filed 2012·Application pending·0 cites
- 1337US2013016037A1Reducing or eliminating the black mask in an optical stackQUALCOMM MEMS TECHNOLOGIES INC·Filed 2011·Application pending·0 cites
- 1434US2008217759A1Chip package substrate and structure thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 1534US2007194430A1Substrate of chip package and chip package structure thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 1633US2009294952A1Chip package carrier and fabrication method thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2008·Application pending·0 cites
- 1732US2006018065A1Display device and protection circuits thereofHANNSTARDISPLAY CORP·Filed 2005·Application pending·0 cites
- 1831US2007228541A1Method for fabricating chip package structureTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →