Inventor · disambiguated record
Huei-Siang Wong
Also filed as: WONG HUEI-SIANG
7 granted patents·2 pending applications·8 citations·filing 2017–2021
74Inventor score
Files withADVANCED SEMICONDUCTOR ENG9
Top patents by PatentIndex Score
9 records- 0182US10818627B2Electronic component including a conductive pillar and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 27, 2020·4 cites·11 claims
- 0281US11776887B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 3, 2023·1 cites·9 claims
- 0379US11600590B2Semiconductor device and semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 7, 2023·3 cites·17 claims
- 0454US11535509B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 27, 2022·0 cites·13 claims
- 0551US11437292B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 6, 2022·0 cites·15 claims
- 0648US12094772B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 17, 2024·0 cites·7 claims
- 0747US11427466B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 30, 2022·0 cites·16 claims
- 0844US2021210536A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 0944US2021305441A1Semiconductor device package and semiconductor package assemblyADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →