Inventor · disambiguated record
Hung-Mo Wu
Also filed as: WU HUNG-MO
3 granted patents·5 pending applications·9 citations·filing 2003–2021
60Inventor score
Files withNANYA TECHNOLOGY CORP8
Top patents by PatentIndex Score
8 records- 0187US9659886B2Method of fabricating semiconductor device having voids between top metal layers of metal interconnectsNANYA TECHNOLOGY CORP·Filed 2016·Granted May 23, 2017·7 cites·7 claims
- 0275US11189523B2Semiconductor structure and fabrication method thereofNANYA TECHNOLOGY CORP·Filed 2019·Granted Nov 30, 2021·2 cites·3 claims
- 0360US2022028734A1Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0448US9418949B2Semiconductor device having voids between top metal layers of metal interconnectsNANYA TECHNOLOGY CORP·Filed 2013·Granted Aug 16, 2016·0 cites·9 claims
- 0542US2020176377A1Electronic device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 0640US2020286777A1Interconnect structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 0740US2020286775A1Interconnect structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 0835US2004157163A1Method of improving photoresist layer uniformityNANYA TECHNOLOGY CORP·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hung-Mo Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →