Inventor · disambiguated record
Huabin Yan
Also filed as: YAN HUABIN
1 granted patent·2 pending applications·0 citations·filing 2020–2025
13Inventor score
Top patents by PatentIndex Score
3 records- 0164US12254950B2Dies, semiconductor package structures, enable pin configuration methods and memoriesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·11 claims
- 0259US2025191622A1Dies, semiconductor package structures, enable pin configuration methods and memoriesYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0322US2023130948A1Heating module and smoking deviceHUIZHOU PEGASUS TECH CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →