Inventor · disambiguated record

Hui-Ting Yang

Also filed as: YANG HUI · YANG HUI-TING

59 granted patents·11 pending applications·164 citations·filing 2006–2024

98Inventor score

Technology areasH10W A61F H10D B41J H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD39 PROCTER & GAMBLE17 GLOBAL UNICHIP CORP2 UNIV SOUTHEAST2 HITI DIGITAL INC1

Top patents by PatentIndex Score

70 records

0198US11569167B2Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·4 cites·20 claims
0298US10700207B2Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·46 cites·20 claims
0397US11532751B2Metal rail conductors for non-planar semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·20 claims
0496US11923301B2Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·20 claims
0595US12034076B2Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
0695US11688730B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·2 cites·20 claims
0795US10878162B2Metal with buried power for increased IC device densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·13 cites·20 claims
0895US9944073B2Method and apparatus for inkjet printing absorbent article components at desired print resolutionsPROCTER & GAMBLE·Filed 2017·Granted Apr 17, 2018·15 cites·21 claims
0992US11063596B1Frame decoding circuit and method for performing frame decodingGLOBAL UNICHIP CORP·Filed 2021·Granted Jul 13, 2021·4 cites·26 claims
1092US10804402B2Metal rail conductors for non-planar semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·4 cites·20 claims
1190US11133255B2Metal patterning for internal cell routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 28, 2021·2 cites·20 claims
1290US11121256B2Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·2 cites·20 claims
1390US10878158B2Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
1490US10388644B2Method of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·4 cites·20 claims
1589US10658292B2Metal patterning for internal cell routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 19, 2020·4 cites·20 claims
1689US10494767B2Fibrous structures including an active agent and having a graphic printed thereonPROCTER & GAMBLE·Filed 2014·Granted Dec 3, 2019·5 cites·30 claims
1788US10843455B2Method and apparatus for curing inks printed on heat sensitive absorbent article componentsPROCTER & GAMBLE·Filed 2018·Granted Nov 24, 2020·2 cites·20 claims
1888US10096522B2Dummy MOL removal for performance enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 9, 2018·4 cites·20 claims
1988US2024364811A1Semiconductor device having more similar cell densities in alternating rows, and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2087US11970821B2Fibrous structures including an active agent and having a graphic printed thereonPROCTER & GAMBLE·Filed 2023·Granted Apr 30, 2024·0 cites·24 claims
2187US11474554B2Circuit for providing clock to de-serializer in communication physical layerGLOBAL UNICHIP CORP·Filed 2021·Granted Oct 18, 2022·3 cites·18 claims
2287US9693071B1Self-adaptive load balance optimization for multicore parallel processing of video dataVISUALON INC·Filed 2014·Granted Jun 27, 2017·14 cites·18 claims
2387US8405694B2Method of heating thermal print unit of dye sublimation printerHSU FU-LIANG·Filed 2010·Granted Mar 26, 2013·10 cites·3 claims
2487US2024322042A1Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2586US11409937B2Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
2686US10978439B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
2785US12300608B2Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
2885US12086524B2Semiconductor device having more similar cell densities in alternating rowsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
2985US11795622B2Fibrous structures including an active agent and having a graphic printed thereonPROCTER & GAMBLE·Filed 2023·Granted Oct 24, 2023·0 cites·21 claims
3084US12278230B2Method of manufacturing conductors for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
3184US11018157B2Local interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 25, 2021·3 cites·19 claims
3284US10169515B2Layout modification method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 1, 2019·4 cites·20 claims
3380US11797746B2Method of forming semiconductor device having more similar cell densities in alternating rowsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
3479US11624156B2Fibrous structures including an active agent and having a graphic printed thereonPROCTER & GAMBLE·Filed 2021·Granted Apr 11, 2023·0 cites·25 claims
3577US11293144B2Fibrous structures including an active agent and having a graphic printed thereonPROCTER & GAMBLE·Filed 2019·Granted Apr 5, 2022·0 cites·24 claims
3676US10297588B2Semiconductor device and fabrication method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·2 cites·20 claims
3773US12341098B2Metal patterning for internal cell routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 24, 2025·0 cites·20 claims
3873US11637064B2Advanced metal connection with metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·20 claims
3972US10471738B2Method and apparatus for curing inks printed on fibrous absorbent article componentsPROCTER & GAMBLE·Filed 2018·Granted Nov 12, 2019·2 cites·22 claims
4068US11916077B2Method for routing local interconnect structure at same level as reference metal lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
4168US10162930B2Method of adjusting metal line pitchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·1 cites·20 claims
4264US11688691B2Method of making standard cells having via rail and deep via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
4364US11043426B2Dummy MOL removal for performance enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
4464US10847460B2Advanced metal connection with metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
4563US12068305B2Multiple fin height integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
4663US10867917B1Semiconductor device, associated method and layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
4762US2019210364A1Method and apparatus for inkjet printing nonwoven absorbent article componentsPROCTER & GAMBLE·Filed 2019·Application pending·0 cites
4861US10468349B2Advanced metal connection with metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·0 cites·16 claims
4961US2024194682A1Local interconnect structureTIAWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
5060US12463478B2Rotor, permanent-magnet motor, motor drive system, and vehicleSHENZHEN YINWANG INTELLIGENT TECHNOLOGY CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims

Showing the top 50 of 70 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →