Inventor · disambiguated record
Hung-Yu Yen
Also filed as: YEN HUNG · YEN HUNG-YU
6 granted patents·14 pending applications·2 citations·filing 2020–2025
69Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20
Top patents by PatentIndex Score
20 records- 0186US11772228B2Chemical mechanical polishing apparatus including a multi-zone platenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 3, 2023·2 cites·20 claims
- 0278US2025366140A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US2025351475A1Metal-Comprising Bottom Isolation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0576US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0673US2025329581A1Semiconductor device having air gap and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0770US2024371961A1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0869US2023364733A1Chemical Mechanical Polishing Apparatus Including a Multi-Zone PlatenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0968US12368073B2Semiconductor device having air gap and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1068US2025126870A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1167US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1263US12094947B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 1359US2025305135A1Semiconductor device with spacer layers formed by precursor compound, film deposited with the same, and method of manufacturing the filmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1459US2025308981A1Method for forming caulking layer, method of manufacturing electronic device and semiconductor device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1557US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 1654US2024395597A1Method for performing trench isolation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1753US2024332357A1Transistor Contacts and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1852US2024355825A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1949US2023387312A1Semiconductor device having isolation structure to reduce current leakageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2048US2023047641A1Film deposition and treatment process for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →