Inventor · disambiguated record
Hui Yu
Also filed as: YU HUI · YU HUI C · YU HUI-CHANG
26 granted patents·15 pending applications·25 citations·filing 2003–2025
93Inventor score
Files withSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD20TAIWAN SEMICONDUCTOR MFG CO LTD15LAN WEN-JENG2CHANG CHIEN CHIN C1CHENG CHI-MING1
Top patents by PatentIndex Score
41 records- 0194US11967644B2Semiconductor device comprising separate different well regions with doping typesSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Granted Apr 23, 2024·2 cites·8 claims
- 0286US2025300036A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0386US2025364519A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0485US12354928B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0583US10998416B2Laterally diffused metal oxide semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted May 4, 2021·3 cites·18 claims
- 0682US11996346B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 0782US11251276B2LDMOS transistor and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Feb 15, 2022·3 cites·15 claims
- 0882US2024194782A1Semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2024·Application pending·0 cites
- 0980US2025349787A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US11121251B2Laterally diffused metal oxide semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Sep 14, 2021·2 cites·7 claims
- 1178US12021042B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 1278US10903340B2Laterally diffused metal oxide semiconductor structure and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Jan 26, 2021·2 cites·19 claims
- 1377US2024387497A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1477US2024312930A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1574US12310098B2Semiconductor structure having a semiconductor substrate and an isolation componentSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2022·Granted May 20, 2025·0 cites·11 claims
- 1674US11699631B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 1774US11031497B2Semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Jun 8, 2021·1 cites·9 claims
- 1873US12119343B2Semiconductor structure having a semiconductor substrate and an isolation componentSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2022·Granted Oct 15, 2024·0 cites·10 claims
- 1972US11581433B2Method for manufacturing a lateral double-diffused metal-oxide-semiconductor (ldmos) transistorSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Feb 14, 2023·0 cites·9 claims
- 2072US2024250055A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2171US2025316560A1Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2270US11637072B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 2370US11031388B2Semiconductor structure and driving chipSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Jun 8, 2021·1 cites·12 claims
- 2468US12469834B2Semiconductor package and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 11, 2025·0 cites·20 claims
- 2567US6914007B2In-situ discharge to avoid arcing during plasma etch processesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 5, 2005·11 cites·42 claims
- 2665US11978715B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 2764US12166091B2LDMOS transistor and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2022·Granted Dec 10, 2024·0 cites·10 claims
- 2862US11710787B2Laterally diffused metal oxide semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Jul 25, 2023·0 cites·11 claims
- 2961US12374600B2Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 3061US11942540B2Semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Mar 26, 2024·0 cites·12 claims
- 3160US11742206B2Laterally diffused metal oxide semiconductor device and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Aug 29, 2023·0 cites·12 claims
- 3259US11830932B2Laterally diffused metal oxide semiconductor structure and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Nov 28, 2023·0 cites·17 claims
- 3359US11417647B2Semiconductor structure having a semiconducture substrate and an isolation componentSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Aug 16, 2022·0 cites·8 claims
- 3452US2025040230A1Semiconductor device and manufacturing method of semiconductor deviceSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2024·Application pending·0 cites
- 3551US2022384430A1Electrode structure, semiconductor structure, and manufacturing method of electrode structureSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2022·Application pending·0 cites
- 3644US11329153B2Method for manufacturing laterally diffused metal oxide semiconductor device and semiconductor deviceSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted May 10, 2022·0 cites·16 claims
- 3742US2005264178A1Organic electroluminescent device and method for manufacturing the sameLAN WEN-JENG·Filed 2005·Application pending·0 cites
- 3840US2007126340A1Electrode arrangement of organic light emitting diodeUNIVISION TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3938US2006208633A1Organic electroluminescent device with improved lifetime and method for fabricating the sameCHENG CHI-MING·Filed 2005·Application pending·0 cites
- 4035US2006243968A1Organic electroluminescent device for preventing long distance shortCHANG CHIEN CHIN C·Filed 2006·Application pending·0 cites
- 4132US2006040133A1Electrode structure of organic electroluminescent display panel and method of manufacturing the sameLAN WEN-JENG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →