Inventor · disambiguated record
Hwanyoung Choi
Also filed as: CHOI HWANYOUNG
2 granted patents·8 pending applications·0 citations·filing 2012–2023
22Inventor score
Top patents by PatentIndex Score
10 records- 0153US2024120263A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0251US2024063103A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0351US2024063129A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0450US2024170440A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0549US11756935B2Chip-stacked semiconductor package with increased package reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 0649US2024170358A1Semiconductor packages having heat dissipation pillarsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0748US2024014086A1Semiconductor package and method for manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0846US2024014117A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0942US12463105B2Semiconductor package including a dummy chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·13 claims
- 1042US2013088889A1Backlight unit and display device having the sameKIM YOUNGCHAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →