Inventor · disambiguated record
Hwa Jin Jeong
Also filed as: JEONG HWA JIN
4 granted patents·150 citations·filing 1997–2022
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0187US5990692ATesting apparatus for non-packaged semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Nov 23, 1999·114 cites·13 claims
- 0276USD494196SPad for grinding stoneEHWA DIAMOND IND CO LTD·Filed 2002·Granted Aug 10, 2004·24 cites·1 claims
- 0361USD1004393SGrinding padEHWA DIAMOND IND CO LTD·Filed 2022·Granted Nov 14, 2023·2 cites·1 claims
- 0453USD502378SPad for grinding stoneEHWA DIAMOND IND CO LTD·Filed 2002·Granted Mar 1, 2005·10 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →