Inventor · disambiguated record
Hwail Jin
Also filed as: JIN HWAIL
6 granted patents·9 pending applications·19 citations·filing 2002–2024
75Inventor score
Top patents by PatentIndex Score
15 records- 0191US11842982B2Semiconductor package with curing layer between semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 12, 2023·3 cites·17 claims
- 0290US12074142B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·2 cites·20 claims
- 0388US7326754B2Thermoset adhesive filmsNIKOLIC NIKOLA A·Filed 2005·Granted Feb 5, 2008·14 cites·3 claims
- 0472US2024312826A1Processing tape and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0571US2024371835A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0661US12040213B2Processing tape and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·8 claims
- 0753US2005137340A1Thermoset adhesive filmsFiled 2005·Application pending·0 cites
- 0852US12469822B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·14 claims
- 0949US2023212440A1Adhesive composition and wafer processing tape including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1048US10910339B2Flip chip bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·19 claims
- 1147US2003232926A1Thermoset adhesive filmsFiled 2002·Application pending·0 cites
- 1238US2007003758A1Dicing die bonding filmNAT STARCH CHEM INVEST·Filed 2006·Application pending·0 cites
- 1334US2009311520A1Multi-layer adhesive film for die stackingJIN HWAIL·Filed 2005·Application pending·0 cites
- 1431US2005227064A1Dicing die bonding filmJIN HWAIL·Filed 2004·Application pending·0 cites
- 1530US2010279469A1Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using SameJIN HWAIL·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →