Inventor · disambiguated record
Hwanwook Jung
Also filed as: JUNG HWANWOOK
1 granted patent·2 pending applications·0 citations·filing 2022–2025
5Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0142US2023260888A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0241US12512442B2Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0336US2025385146A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →