Inventor · disambiguated record

Hwan Bin Kim

Also filed as: KIM HWAN BIN

1 granted patent·1 pending application·0 citations·filing 2021–2021

10Inventor score

Technology areasH10P

Files withSEMES CO LTD2

Top patents by PatentIndex Score

2 records

0155US12061097B2Substrate type sensor for measuring horizontality of substrate support member provided in atmosphere accompanied by temperature change, method for measuring horizontality of substrate support member by using the same, and non-transitory computer readable mediumSEMES CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·6 claims
0242US2022088644A1Unit for removing adhesive layer and method using the sameSEMES CO LTD·Filed 2021·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →