Inventor · disambiguated record
Hwayoung Lee
Also filed as: LEE HWAYOUNG
4 granted patents·3 pending applications·2 citations·filing 2018–2023
59Inventor score
Top patents by PatentIndex Score
7 records- 0190US11676914B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0268US12062626B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 0365US12512429B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0452US12322598B2Method of processing substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·19 claims
- 0549US2023082384A1Substrate processing apparatus and method of manufacturing semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0647US2022392851A1Semiconductor chip and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0734US2022012119A1Multiple module scheduling device and systemRTST CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →