Inventor · disambiguated record
Hwa-Sun Park
Also filed as: PARK HWA SUN
12 granted patents·8 pending applications·71 citations·filing 2004–2023
88Inventor score
Files withSAMSUNG ELECTRO MECH8UNIV SUNGKYUNKWAN RES & BUS3KIM WOON CHUN2BYUN JUNG-SOO1JEONG JIN-SOO1
Top patents by PatentIndex Score
20 records- 0193US8633397B2Method of processing cavity of core substrateJEONG JIN-SOO·Filed 2010·Granted Jan 21, 2014·40 cites·11 claims
- 0279US7886414B2Method of manufacturing capacitor-embedded PCBSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·7 cites·5 claims
- 0377US8482890B2PCB strip and manufacturing method for electronic component embedded PCBKIM MOON-IL·Filed 2010·Granted Jul 9, 2013·6 cites·8 claims
- 0477US8302270B2Method of manufacturing capacitor-embedded PCBKIM WOON-CHUN·Filed 2011·Granted Nov 6, 2012·3 cites·5 claims
- 0577US7730612B2Method of manufacturing component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 8, 2010·7 cites·3 claims
- 0662US8166653B2Method of manufacturing printed circuit board having embedded resistorsPARK HWA SUN·Filed 2010·Granted May 1, 2012·2 cites·14 claims
- 0760US9000593B2Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereofSUH SU JEONG·Filed 2012·Granted Apr 7, 2015·2 cites·9 claims
- 0860US8618421B2Electronics component embedded PCBBYUN JUNG-SOO·Filed 2010·Granted Dec 31, 2013·2 cites·3 claims
- 0955US2009244864A1Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1053US2012152886A1Method of manufacturing substrate for capacitor-embedded printed circuit board and capacitor-embedded printed circuit boardKIM WOON-CHUN·Filed 2012·Application pending·0 cites
- 1151US2014123486A1Method of processing cavity of core substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1249US2008110669A1Printed circuit board having embedded resistors and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1347US7328504B2Method for manufacturing circuit board with built-in electronic componentsSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 12, 2008·0 cites·7 claims
- 1447US2025338392A1Low-loss flat-cable signal line for ultra-high frequency, flexible printed circuit board using the same, and flexible printed circuit board continuous-manufacturing deviceSAMWON ACT CO LTD·Filed 2023·Application pending·0 cites
- 1547US2010097770A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1646US7037739B2Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiencyKOREA INST SCI & TECH·Filed 2004·Granted May 2, 2006·2 cites·2 claims
- 1745US2009301766A1Printed circuit board including electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1843US9136455B2Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereofUNIV SUNGKYUNKWAN RES & BUS·Filed 2015·Granted Sep 15, 2015·0 cites·5 claims
- 1929US9356005B2Package of light emitting diode with heat sinkUNIV SUNGKYUNKWAN RES & BUS·Filed 2015·Granted May 31, 2016·0 cites·23 claims
- 2028US2015200343A1Substrate for light emitting diode and method of manufacturing the same and light source apparatus including the substrateUNIV SUNGKYUNKWAN RES & BUS·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →