Inventor · disambiguated record
Hwanjoo Park
Also filed as: PARK HWANJOO
0 granted patents·17 pending applications·0 citations·filing 2022–2024
Files withSAMSUNG ELECTRONICS CO LTD17
Top patents by PatentIndex Score
17 records- 0161US2024413038A1Stacked semiconductor package and lower semiconductor package used for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0261US2025015049A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0360US2024321841A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0460US2025079338A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0559US2025062279A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0659US2024332150A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2024321681A1Heat dissipation structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0857US2024321673A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0957US2024321669A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1056US2024055339A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1155US2024072020A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1255US2024079366A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1354US2024119211A1Semiconductor design optimization systems and methods of operation thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1453US2024145360A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US2023307318A1Semiconductor package and cooling system thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1651US2025233030A1Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1744US2025105088A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →