Inventor · disambiguated record
Hwang Kyu Yun
Also filed as: YUN HWANG K · YUN HWANG KYU
4 granted patents·1 pending application·22 citations·filing 1994–2025
71Inventor score
Files withHENKEL AG & CO KGAA1Henkel IP & Holding GmbH1JI QING1SAMSUNG ELECTRONICS CO LTD1YUN HWANG KYU1
Top patents by PatentIndex Score
5 records- 0162US9082840B2Coating adhesives onto dicing before grinding and micro-fabricated wafersHenkel IP & Holding GmbH·Filed 2014·Granted Jul 14, 2015·1 cites·3 claims
- 0262US8753959B2Coating adhesives onto dicing before grinding and micro-fabricated wafersYUN HWANG KYU·Filed 2012·Granted Jun 17, 2014·2 cites·5 claims
- 0362US5543493AMethod for treating a polyimide surfaceSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Aug 6, 1996·17 cites·20 claims
- 0460US2025206921A1Resin composition for die attach film with excellent performance with large die applicationsHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 0547US8075721B2Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkabilityJI QING·Filed 2006·Granted Dec 13, 2011·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →