Inventor · disambiguated record
Hyunna Bae
Also filed as: BAE HYUNNA
0 granted patents·2 pending applications·0 citations·filing 2023–2023
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0159US2024234276A9Fan-out semiconductor package and method of manufacturing the fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0257US2024321774A1Semiconductor device, method of manufacturing semiconductor device, and semiconductor package including semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →