Inventor · disambiguated record
Hyunggil Baek
Also filed as: BAEK HYUNGGIL
11 granted patents·8 pending applications·20 citations·filing 2010–2025
83Inventor score
Top patents by PatentIndex Score
19 records- 0186US10872875B2Bonding head and method for bonding semiconductor package, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 22, 2020·7 cites·19 claims
- 0279US8218346B2Multi-chip packages including extra memory chips to define additional logical packages and related devicesBAEK HYUNGGIL·Filed 2010·Granted Jul 10, 2012·10 cites·21 claims
- 0376US10418335B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·15 claims
- 0472US10916509B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·1 cites·19 claims
- 0570US12087650B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0665US2025253163A1Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0762US12308253B2Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0858US12494439B2Semiconductor packages having fixing membersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0958US11688656B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·15 claims
- 1057US12469749B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·19 claims
- 1157US12205925B2Semiconductor package having package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1253US2024421011A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1352US12208541B2Dicing blade including diamond particlesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 1450US2024290750A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1550US2025336750A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1648US2024203958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1747US2024321775A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1847US2024429146A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1939US2013166093A1Electronic device and temperature control method thereofKIM JAE CHOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →