Inventor · disambiguated record
Hyung Gil Baik
Also filed as: BAIK HYUNG GIL
4 granted patents·163 citations·filing 1999–2004
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0190US6316825B1Chip stack package utilizing a connecting hole to improve electrical connection between leadframesHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 13, 2001·112 cites·6 claims
- 0276US6841863B2Ball grid array package with stacked center pad chips and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Jan 11, 2005·24 cites·6 claims
- 0370US6677181B2Method for fabricating stacked chip package deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Jan 13, 2004·16 cites·10 claims
- 0462US7115442B2Ball grid array package with stacked center pad chips and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2004·Granted Oct 3, 2006·11 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →