Inventor · disambiguated record
Hyo-Dong Ban
Also filed as: BAN HYO-DONG
15 granted patents·194 citations·filing 1997–2020
93Inventor score
Top patents by PatentIndex Score
15 records- 0191US10886277B2Methods of manufacturing devices including a buried gate cell and a bit line structure including a thermal oxide buffer patternSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 5, 2021·7 cites·9 claims
- 0286US8928073B2Semiconductor devices including guard ring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·8 cites·19 claims
- 0386US6589837B1Buried contact structure in semiconductor device and method of making the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jul 8, 2003·36 cites·27 claims
- 0486US6566735B1Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption filmSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 20, 2003·38 cites·7 claims
- 0579US6448113B2Method of forming fuse area structure including protection film on sidewall of fuse opening in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 10, 2002·29 cites·14 claims
- 0673US6071802AMethod for manufacturing semiconductor device having self-aligned contactSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jun 6, 2000·28 cites·34 claims
- 0771US6316803B1Integrated circuit memory devices having self-aligned contactSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Nov 13, 2001·12 cites·11 claims
- 0866US6696353B2Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption filmSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 24, 2004·11 cites·11 claims
- 0965US11574912B2Memory devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 1064USRE46549EIntegrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption filmCONVERSANT INTELLECTUAL PROPERTY MAN INC·Filed 2013·Granted Sep 12, 2017·1 cites·9 claims
- 1162US6555450B2Contact forming method for semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 29, 2003·13 cites·7 claims
- 1259US7081389B2Semiconductor devices having dual capping layer patterns and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 25, 2006·9 cites·11 claims
- 1354US7339223B2Semiconductor devices having dual capping layer patterns and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 4, 2008·2 cites·11 claims
- 1447US7667331B2Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chipSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 23, 2010·0 cites·20 claims
- 1538US6835998B2Fuse area structure including protection film on sidewall of fuse opening in semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 28, 2004·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →