Inventor · disambiguated record
Hyung-Jik Byun
Also filed as: BYUN HYUNG JIK
2 granted patents·3 pending applications·34 citations·filing 2002–2008
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0175US6736306B2Semiconductor chip package comprising enhanced padsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 18, 2004·27 cites·26 claims
- 0253US7023096B2Multi-chip package having spacer that is inserted between chips and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 4, 2006·7 cites·12 claims
- 0343US2008290513A1Semiconductor package having molded balls and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0440US2008088037A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0530US2006131067A1PCB, manufacturing method thereof and semiconductor package implementing the sameBYUN HYUNG-JIK·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →