Inventor · disambiguated record
Hyung-Sik Byun
Also filed as: BYUN HYUNG JIK · BYUN HYUNG-SIK
5 granted patents·5 pending applications·7 citations·filing 2002–2014
68Inventor score
Top patents by PatentIndex Score
10 records- 0162US7782499B2Image scanning apparatus with preview function and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 24, 2010·2 cites·20 claims
- 0258US8736856B2Method of executing additional extended feature of image forming apparatus and image forming apparatus to perform the sameBYUN HYUNG-SIK·Filed 2010·Granted May 27, 2014·2 cites·19 claims
- 0357US8171190B2Direct image formation method and apparatusBYUN HYUNG-SIK·Filed 2005·Granted May 1, 2012·3 cites·17 claims
- 0445US2005146760A1Apparatus and method for scanning specific area of document in a scanning apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 0544US8804164B2Image forming system and control method using middlewareBYUN HYUNG-SIK·Filed 2008·Granted Aug 12, 2014·0 cites·19 claims
- 0641US2015029540A1Image forming apparatus and mobile device for forming wireless configuration by using near field communication (nfc)SAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0738US7162166B2Image-forming apparatus having an automatic self-test reporting function and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 9, 2007·0 cites·20 claims
- 0838US2004239997A1Method and apparatus to process facsimile data using a computerFiled 2004·Application pending·0 cites
- 0937US2006158700A1Scanning apparatus, scanning system having the same, and scanning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1032US2003025190A1Tape ball grid array semiconductor chip package having ball land pad isolated from adhesive, a method of manufacturing the same and a multi-chip packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →