Inventor · disambiguated record
Hyoukyung Cho
Also filed as: CHO HYOUKYUNG
9 granted patents·1 pending application·1 citations·filing 2020–2024
76Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0179US11664316B2Semiconductor devices having penetration vias with portions having decreasing widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·1 cites·11 claims
- 0271US2024274509A1Semiconductor device including through-electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0370US12300671B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0468US12347781B2Semiconductor devices having penetration viasSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 0564US11694980B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·9 claims
- 0663US11961788B2Semiconductor device including through-electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·13 claims
- 0763US11315894B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·21 claims
- 0859US11810900B2Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 0952US11804419B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 1049US11373932B2Semiconductor packages including through holes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →