Inventor · disambiguated record
Hyung Ho Cho
Also filed as: CHO HYUNG-HO
5 granted patents·1 pending application·4 citations·filing 2006–2021
66Inventor score
Top patents by PatentIndex Score
6 records- 0186US11183470B2Semiconductor package including decoupling capacitorSK HYNIX INC·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0265US11715708B2Semiconductor package including decoupling capacitorSK HYNIX INC·Filed 2021·Granted Aug 1, 2023·0 cites·12 claims
- 0350US12021515B2Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chipSK HYNIX INC·Filed 2021·Granted Jun 25, 2024·0 cites·16 claims
- 0450US9953965B2Semiconductor packageSK HYNIX INC·Filed 2016·Granted Apr 24, 2018·2 cites·19 claims
- 0548US11682643B2Semiconductor chip having chip pads of different surface areas, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Jun 20, 2023·0 cites·10 claims
- 0632US2007195255A1Assembled substrate for liquid crystal panel, method of cutting the assembled substrate, and liquid crystal panel manufatured therebySAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →