Inventor · disambiguated record
Hyunho Chu
Also filed as: CHU HYUNHO
0 granted patents·4 pending applications·0 citations·filing 2024–2024
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0160US2025183219A1Semiconductor packages with chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0258US2025336827A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0355US2025118565A1Method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0443US2025078249A1Method of inspecting a mark engraved on a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hyunho Chu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →