Inventor · disambiguated record
Hyunsuk Chun
Also filed as: CHUN HYUNSUK
27 granted patents·7 pending applications·36 citations·filing 2014–2025
94Inventor score
Files withMICRON TECHNOLOGY INC26SAMSUNG ELECTRONICS CO LTD3AVAGO TECH INT SALES PTE LID2LODESTAR LICENSING GROUP LLC2CHUN HYUNSUK1
Top patents by PatentIndex Score
34 records- 0196US11538762B2Methods for making double-sided semiconductor devices and related devices, assemblies, packages and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 27, 2022·5 cites·24 claims
- 0296US11515171B2Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·4 cites·37 claims
- 0390US11444037B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 13, 2022·2 cites·22 claims
- 0489US11211364B1Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·2 cites·20 claims
- 0585US10784212B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 22, 2020·3 cites·22 claims
- 0683US10811365B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·3 cites·18 claims
- 0783US9402315B2Semiconductor package having magnetic connection memberSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 26, 2016·7 cites·5 claims
- 0878US2024339437A1Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0976US11848282B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 19, 2023·0 cites·22 claims
- 1076US9397052B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 19, 2016·4 cites·17 claims
- 1175US2025229351A1Two-step solder-mask-defined designLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1273US12015011B2Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 18, 2024·0 cites·18 claims
- 1372US12243801B2Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·19 claims
- 1471US10515911B2Semiconductor devicesCHUN HYUNSUK·Filed 2015·Granted Dec 24, 2019·3 cites·20 claims
- 1570US12269106B2Two-step solder-mask-defined designLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Apr 8, 2025·0 cites·12 claims
- 1669US11557526B2Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 17, 2023·0 cites·18 claims
- 1768US11011452B2Heat spreaders for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 18, 2021·1 cites·23 claims
- 1867US12028962B2Thermal management of circuit boardsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 2, 2024·0 cites·15 claims
- 1966US9601466B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·15 claims
- 2065US11616028B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 28, 2023·0 cites·19 claims
- 2164US11688658B2Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 2261US11887920B2Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 30, 2024·0 cites·17 claims
- 2361US11207744B2Two-step solder-mask-defined designMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 28, 2021·0 cites·18 claims
- 2460US11915997B2Thermal management of GPU-HBM package by microchannel integrated substrateMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 27, 2024·0 cites·10 claims
- 2560US11419239B2Thermal management of circuit boardsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 16, 2022·0 cites·15 claims
- 2659US11385281B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 12, 2022·0 cites·15 claims
- 2759US2021225733A1Heat spreaders for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 2854US2024203898A1Electromagnetic shielding structureAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2954US2024363473A1Thermal management systems and methods for semiconductor devicesAVAGO TECH INT SALES PTE LID·Filed 2023·Application pending·0 cites
- 3053US10653033B1Kits for enhanced cooling of components of computing devices and related computing devices, systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 12, 2020·0 cites·23 claims
- 3150US10861782B2Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 8, 2020·0 cites·21 claims
- 3246US2019067145A1Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 3345US2021272872A1Thermal management materials for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 3443US11676932B2Semiconductor interconnect structures with narrowed portions, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 13, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →