Inventor · disambiguated record
Hyung-Sik Chung
Also filed as: CHUNG HYUNG SIK
3 granted patents·1 pending application·59 citations·filing 1996–2007
72Inventor score
Top patents by PatentIndex Score
4 records- 0188US6346181B1Electroplating process for preparing a Ni layer of biaxial textureKOREA MACH & MATERIALS INST·Filed 2000·Granted Feb 12, 2002·39 cites·6 claims
- 0258US5722037AProcess for producing Ti/TiC composite by hydrocarbon gas and Ti powder reactionKOREA MACH & MATERIALS INST·Filed 1996·Granted Feb 24, 1998·15 cites·8 claims
- 0345US2007187006A1Aluminum alloy containing copper and zincUNIV AJOU IND COOP FOUNDATION·Filed 2007·Application pending·0 cites
- 0433US6209190B1Production of MgO dispersed Bi-2223 superconductorKOREA MACH & MATERIALS INST·Filed 1996·Granted Apr 3, 2001·5 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →