Inventor · disambiguated record
Hyung-Lae Eun
Also filed as: EUN HYUNG-LAE
7 granted patents·1 pending application·37 citations·filing 2006–2020
81Inventor score
Top patents by PatentIndex Score
8 records- 0185US8436455B2Stacked structure of semiconductor packages including through-silicon via and inter-package connector, and method of fabricating the sameEUN HYUNG-LAE·Filed 2010·Granted May 7, 2013·14 cites·19 claims
- 0285US7615858B2Stacked-type semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 10, 2009·15 cites·19 claims
- 0368US7663217B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·4 cites·20 claims
- 0464US7385277B2Semiconductor chip and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 10, 2008·2 cites·25 claims
- 0558US7608910B2Semiconductor ESD device and methods of protecting a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 27, 2009·2 cites·16 claims
- 0649US2010013075A1Stacked-type semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0747US9761563B2Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the sameEUN HYUNG-LAE·Filed 2016·Granted Sep 12, 2017·0 cites·20 claims
- 0842US11461113B2Training method of memory device and electronic device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →