Inventor · disambiguated record
Hyun Hee Gu
Also filed as: GU HYUN HEE
53 granted patents·18 pending applications·155 citations·filing 2010–2024
98Inventor score
Top patents by PatentIndex Score
71 records- 0198US11348732B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2020·Granted May 31, 2022·5 cites·23 claims
- 0298US11239032B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 1, 2022·6 cites·16 claims
- 0397US11587735B2Multilayer electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 21, 2023·8 cites·20 claims
- 0495US11264170B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 1, 2022·3 cites·20 claims
- 0593US9974183B2Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted May 15, 2018·10 cites·11 claims
- 0693US9818547B1Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 14, 2017·8 cites·13 claims
- 0791US10535469B1Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 14, 2020·3 cites·6 claims
- 0891US10529492B1Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 7, 2020·3 cites·14 claims
- 0991US9087644B2Multilayer ceramic electronic component and fabrication method thereofJEON BYUNG JUN·Filed 2012·Granted Jul 21, 2015·11 cites·17 claims
- 1091US8941972B2Multilayer ceramic electronic componentPARK MYUNG JUN·Filed 2012·Granted Jan 27, 2015·9 cites·24 claims
- 1191US8837112B2Multilayer ceramic electronic component and method of fabricating the sameGU HYUN HEE·Filed 2012·Granted Sep 16, 2014·15 cites·12 claims
- 1290US11342123B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted May 24, 2022·2 cites·12 claims
- 1389US11651899B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2022·Granted May 16, 2023·1 cites·13 claims
- 1488US10573460B2Multilayer ceramic electronic component and board for mounting of the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 25, 2020·5 cites·12 claims
- 1588US10373759B1Multilayer ceramic electronic component having external electrodes with holes in plating layersSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 6, 2019·4 cites·11 claims
- 1688US9439301B2Multilayered chip electronic component and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 6, 2016·8 cites·20 claims
- 1786US10187994B2Capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 22, 2019·3 cites·42 claims
- 1886US9318264B2Multilayer ceramic deviceSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 19, 2016·6 cites·9 claims
- 1986US9251956B2Conductive resin composition and multilayer ceramic capacitor having the sameKANG SUNG KOO·Filed 2012·Granted Feb 2, 2016·6 cites·13 claims
- 2086US8842413B2Multilayered ceramic electronic componentPARK MYUNG JUN·Filed 2012·Granted Sep 23, 2014·8 cites·5 claims
- 2185US9019690B2Conductive resin composition, multilayer ceramic capacitor having the same, and method of manufacturing the multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 28, 2015·5 cites·13 claims
- 2284US10886066B2Multilayer ceramic capacitor including external electrode having tin-plated layers alternately stacked with nickel-plated layer(s)SAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 5, 2021·2 cites·26 claims
- 2383US10062506B2Capacitor and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 28, 2018·2 cites·19 claims
- 2482US11935701B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Mar 19, 2024·0 cites·14 claims
- 2581US8941971B2Multilayer ceramic electronic component and fabrication method thereofPARK MYUNG JUN·Filed 2012·Granted Jan 27, 2015·4 cites·9 claims
- 2680US9165712B2Multilayer ceramic electronic component and fabrication method thereofJEON BYUNG JUN·Filed 2012·Granted Oct 20, 2015·4 cites·3 claims
- 2779US9743514B2Multilayer ceramic electronic component, method of manufacturing the same, and circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 22, 2017·3 cites·41 claims
- 2879US9343232B2Conductive paste composition for external electrode and multilayer ceramic electronic component including the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 17, 2016·2 cites·12 claims
- 2976US10892101B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 12, 2021·1 cites·17 claims
- 3076US10861650B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 8, 2020·1 cites·19 claims
- 3175US11901130B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 3275US8675343B2Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereofPARK MYUNG JUN·Filed 2012·Granted Mar 18, 2014·2 cites·19 claims
- 3374US9218909B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 22, 2015·2 cites·12 claims
- 3474US8767375B2Multilayer ceramic electronic component and method of fabricating the samePARK MYUNG JUN·Filed 2012·Granted Jul 1, 2014·2 cites·14 claims
- 3572US11699554B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 3672US11646161B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 9, 2023·0 cites·14 claims
- 3771US11682526B2Multilayer ceramic electronic component and board for mounting of the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 20, 2023·0 cites·17 claims
- 3871US11657978B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 23, 2023·0 cites·18 claims
- 3971US10886068B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 5, 2021·0 cites·16 claims
- 4070US9305705B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 5, 2016·1 cites·32 claims
- 4168US11069481B2Multilayer ceramic electronic component and board for mounting of the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 20, 2021·0 cites·18 claims
- 4267US12340945B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 4365US10559428B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 11, 2020·0 cites·13 claims
- 4464US10978250B2Method of manufacturing capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 13, 2021·0 cites·20 claims
- 4562US10580578B1Multilayer ceramic electronic component having external electrode layers with holesSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 3, 2020·0 cites·16 claims
- 4660US12374498B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Jul 29, 2025·0 cites·23 claims
- 4759US10537025B2Capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 14, 2020·0 cites·22 claims
- 4859US10199133B2Conductive resin composition and multilayer ceramic capacitor having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Feb 5, 2019·0 cites·12 claims
- 4959US2025140474A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 5058US2025166912A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hyun Hee Gu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →