Inventor · disambiguated record
Hyeong Hur
Also filed as: HUR HYEONG R · HUR HYEONG RYEOL
1 granted patent·2 pending applications·56 citations·filing 2003–2005
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0184US6833287B1System for semiconductor package with stacked diesST ASSEMBLY TEST SERVICES INC·Filed 2003·Granted Dec 21, 2004·56 cites·20 claims
- 0236US2005194698A1Integrated circuit package with keep-out zone overlapping undercut zoneST ASSEMBLY TEST SERVICE LTD·Filed 2004·Application pending·0 cites
- 0334US2006160267A1Under bump metallurgy in integrated circuitsSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →