Inventor · disambiguated record
Hyun-Ik Hwang
Also filed as: HWANG HYUN-IK
4 granted patents·3 pending applications·26 citations·filing 2004–2011
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0187US7291925B2Stack package using anisotropic conductive film (ACF) and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 6, 2007·19 cites·11 claims
- 0268US7405105B2Stack package using anisotropic conductive film (ACF) and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 29, 2008·4 cites·5 claims
- 0359US7989939B2Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 2, 2011·3 cites·14 claims
- 0440US2009166879A1Semiconductor packageSONG KUN-HO·Filed 2008·Application pending·0 cites
- 0536US7288436B2Semiconductor chip package manufacturing method including screen printing processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 30, 2007·0 cites·12 claims
- 0636US2006118831A1Semiconductor package and manufacturing method thereofHWANG HYUN-IK·Filed 2005·Application pending·0 cites
- 0735US2012013007A1Package-on-package semiconductor package having spacers disposed between two package substratesHWANG HYUN-IK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →