Inventor · disambiguated record
Hyeon Hwang
Also filed as: HWANG HYEON · HWANG HYEON JEONG
6 granted patents·7 pending applications·299 citations·filing 2004–2024
82Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0195US7494845B2Method of forming a thin wafer stack for a wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 24, 2009·247 cites·23 claims
- 0292US11862603B2Semiconductor packages with chips partially embedded in adhesiveSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·18 claims
- 0384US7294531B2Wafer level chip stack methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 13, 2007·44 cites·18 claims
- 0475US12495504B2Ball attach toolSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 0566US7479455B2Method for manufacturing semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 20, 2009·3 cites·22 claims
- 0661US2025118689A1Semiconductor package having a controllerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0757US7262114B2Die attaching method of semiconductor chip using warpage prevention materialSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·1 cites·14 claims
- 0857US2025014963A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0954US2025183113A1Semiconductor package including heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US2024203854A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US2025096148A1Method of marking semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1249US2025029864A1Chuck table and semiconductor package manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1339US2006202332A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →